廣東高仕電研科技有限公司
廣東高仕電研科技有限公司
紫外光固化噴墨打印字符材料UVCurableInkjetMarkingmatIJM-300系列IJM-300系列是我公司自主研發，擁有自主知識產權的UV固化噴墨打印PCB油墨，公開號：ZL.6
紫外光固化噴墨打印字符材料 UV Curable Inkjet Marking mat
IJM-300 系列
IJM-300 系列 是我公司自主研發，擁有自主知識產權的UV固化噴墨打印PCB油墨，公開號：ZL.6。此產品采用國外進口原材料及生產檢測設備，產品性能達到同類產品水平。產品特點有：
較低的UV能量可快速固化，可以LED光源固化。
較好的儲存沉降穩定性、良好的噴墨穩定性。50℃條件下放置30天不返粗。
良好的表面硬度及阻焊性，表面硬度可以6H以上，良好的遮蓋性和耐黃變性。
產品符合歐盟RoHS、REACH要求，環保無鹵。
IJM-300 series is our own independent research and development（The patent publication number is ZL.6）, with independent intellectual property rights of UV curable Inkjet Marking ink for PCB, patent public CN107619824A. The products are imported from foreign raw materials and production testing equipment, and the product performance has reached the international leading level of similar products. The product features:
Fast curing and low energy requirement. LED light can be curing.
Good settling stability. Jet stability and low nozzle failure.
Excellent adhesion and hardness to fully cured solder mask. Opacity for the cured film and non-yellowing.
RoHS and REACH approved and Halogen-free.
一、物性General properties
| 1 | 型號Main agent | IJM-300 WM01 |
| 2 | 顏色Color | 白色white黑色black |
| 3 | 比重Specific gravity | 1.20 |
| 4 | 表面張力Surface tension | 21-25mN/m at 20-25℃ |
| 5 | 保存期限Shelf Life | 6 months after manufacturing (Stored in cool and dark place at 10-20℃) |
| 6 | 包裝規格Package | 1Kg/Cans（瓶），10Kg/Box（箱） |
| 7 | 粘度Viscosity (at 25℃) | 33-37cP (Brookfield 40# 80rpm, 25℃) |
| 8 | 粒徑Grain dicmeter | D50≤290nm 粒徑≤700nm |
| 9. | 粘度溫度曲線 | 激光粒徑分析 |
| 10 |
|  |
二、應用操作流程 Processing instructions
半固化阻焊工藝 semi-cured solder mask
| 阻焊層顯影后線路板 |
| after development of the solder mask |
| ↓ |
| ↓ |
| 噴印 + UV固化 UVA2：100-200mj/cm² UVV:200-500mj/cm² |
| Jetting + UV curableUVA2: 100-200mj/cm2 UVV:200-500mj/cm² |
| ↓ |
| ↓ |
| 熱固化150℃*60min |
| Thermal curing 150℃*60min |
備注：我們推薦客戶使用半固化阻焊工藝，不使用全固化阻焊工藝。
We recommend customers adopt semi-cured solder mask processing. We recommend customer use the
semi-cured solder mask processing, not the full -cured solder mask processing
三、制程注意事項attention on process
| 1、本公司噴印油墨，屬納米級產品。客戶使用車間若潔凈度不夠，灰塵混入油墨中，可能導致噴頭堵塞。產品在儲存及使用過程中，都應特別注意防塵。 Keep the operation room cleaned. the product must be protected for dust.
2、噴印前的板子都應特別注意其潔凈度，防止污染。若線路板本身已被污染，應采取措施進行處理，否則會影響噴印油墨的附著力等可靠性。 The contamination of board cause the quality and reliability deterioration.
3、工作潔凈室的環境溫度應控制在20-25度，濕度50-60%。 Operating in the clean room of the ambient temperature at 20-25℃/50-60%RH.
4、此油墨應在黃光燈下使用，避免陽光或紫外光直射。 Avoid direct exposure to UV and sunlight. Desirable to use ink in yellow lamps.
5、此油墨一般情況下不需要添加開油水可直接使用。不可以添加線路板廠常規開油水使用，若有特殊情況必須添加開油水時請與我司聯系。 Desirable to use ink without dilution. When necessary, Inquire of ours. Because dilution may deteriorate the properties. In this case, solvent must not be applicable.
6、涂層厚度應控制在固化后10-20um為佳，若涂層太厚，容易開裂、附著力、耐化性變差及硬度下降。 Coating thickness should be controlled at 10-15um after curing is preferred. If the coating is too thick, it will be prone to cracking, poor adhesion, corrosion resistance and hardness.
7、固化條件，因設備光源不同，需咨詢設備商，經過測試，找出合適的條件。固化條件不合適時，會引起涂層性能達不到產品預期效果。 As curing condition is variable depending on the type of lamps and the intensity of radiation, set it suitable to your process after testing. Curing condition out of the specified tolerance range may deteriorate the properties of resist coating.
8、清潔噴印頭及噴印管道，請使用我司專用清洗液LN01清潔。 For cleaning ink jet head, please use our special cleaner LN01 . |
四、涂膜性能PROPERRTIES
| 要求Requirement | 測試方法Test Method | 結果Result |
| 防霉性Nonnutrient | IPC-TM-650 2.6.1 | OK |
| 表面狀況Visual Requirements | IPC-SM-840E 3.3.1 | OK |
| 鉛筆硬度Pencil Hardness | ASTM D3363（0.5Kg） | 6H |
| 附著力Adhesion | IPC-TM-650 2.4.28.1 | OK |
| Mach inability可加工性 | IPC-TM-650 2.4.7.1 | OK |
| 耐溶劑Solvents Resistance | IPC-TM-650 2.3.42 涂膜無分離No peeling | OK |
| 耐化學試劑 Acid & Alkaline Resistance | IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃*30min 10wt% NaOH*20℃*30min | OK |
| 水解穩定性Hydrolytic Stability | IPC-TM-650 2.6.11 | OK |
| 可焊性Solder ability | J-STD-003 260±5℃*10秒*3次 | OK |
| 耐焊性Resistance to Solder | IPC-TM-650 2.6.8 助焊劑應依據J-STD-004，使用ROM0或ROM1 Flux shall be a ROM0 or ROM1 per J-STD-004 浮錫Solder Float 260℃*10秒*3次 | OK |
| Simulation of Lead Free Reflow 無鉛回流焊模擬 | IPC-SM-840E 3.7.3.1 Solder Float 浮錫260℃*10秒*5次 | OK |
| 介電強度Dielectric Strength | IPC-TM-650 2.5.6.1 | 1000 V DC/mil |
| 絕緣電阻Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧8.4×1011Ω |
| 耐濕絕緣電阻Moisture and Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧5.0×1011Ω |
| 電遷移Electrochemical Migration | IPC-TM-650 2.6.14 | OK |
| 冷熱沖擊Thermal Shock | IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 | OK |
此資料為本公司試驗結果，不作為保證之用。適宜之條件，需參照操作指引，待貴公司實施確認后，再予以確定。This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.
若英文內容與中文內容有差異，以中文為準。
In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail
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